A failure analysis lab test holds an arsenal of techniques which cater to finding out what exactly is the cause of a malfunctioning seintegrated circuit. Some of these techniques preserve the chip for further testing and are therefore applied before others. They're called Non Destructive Tests or (NDTs). If possible, we'd like to keep a chip in tact not just because we can test it further, but because we can use it as a reference point for future analysis. Chips don't fail very often and having one at hand which is representative of a particular type of flaw can be quite useful.
An example of an NDT is spectrographic testing. Companies use this to find out whether there are any impurities in the material causing it to deviate from expected results. We even use this on healthy chips to help pass ROHS certifications meant to control the use of hazardous substances in chip manufacture.
Other tests involve isolating flaws in the electronic systems. These can be frustrating to discover and it requires quite a lot of skill in reaching the root of the problem. Thermal graphs give us a starting point where we can begin the search.
There are many other semiconductor test scenarios which can occur in a lab and they all rely on detecting errors in some system or the other. With advances in semi conductor technologies and increases in complexity, the art of failure analysis is set to become even more critical in the future.
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